TSMC 2nm fabrication process will soon enter its production stage

Word on the street has it that the TSMC 2nm fabrication process is about to enter its production stage. To facilitate the production process, TSMC might rely on the power of artificial intelligence to a certain extent. According to the sources of this information, TSMC is kicking off pre-production work on their coming 2nm fabrication process.

Currently, the semiconductor industry is making use of the 3nm fabrication process. The next step in the evolution of the industry is the introduction of chips made using the 2nm process. Many competitors such as Intel, Samsung, MediaTek, and so on are preparing to make this technology available to their customers in the coming months.

But it seems as though TSMC has beaten them all to it, as they are already preparing to begin production with the 2nm fabrication process. It seems as though the Taiwanese company is more than ready to kick off the pre-production trial using the 2nm fabrication technology. Here is all the information concerning the TSMC 2nm fabrication process currently in the development stage.

Details on the TSMC 2nm fabrication process that is currently going into pre-production trial

The source of this information points out that TSMC is employing artificial intelligence for the 2nm production process. The artificial intelligence enhancement method is known as AutoDMP and its job is to increase the speed of the design process. This technology puts the Nvidia DGX H100 chip to use to improve its power and performance.

From the available reports, this artificial intelligence-enabled process is 30 times faster than other chip design techniques. With this on the ground, TSMC will be able to hit its target to produce 1,000 wafers before the end of the year. Starting the pre-production trials now is not in line with previous plans to kick off the project next year.

TSMC is moving ahead of the competition to make its 2nm fabrication process ready for usage early enough. By integrating artificial intelligence into its fabrication process, TSMC will reduce carbon emissions. This process will also make use of the gate-all-around (GAAFET) transistors during design.

With this technology, TSMC will be able to cut down transistor density and reduce any current leakage. Some benefit of the GAAFET technology for the end users is that it will improve performance while using less energy. In comparison with chips using the 3nm process, those to launch with the 2nm process will step up the performance bar.

Mass production of 2nm wafers will kick off after the production trial is over. Coming smartphones, tablets, and other smart devices will launch using processors developed on TSMC’s 2nm fabrication process. Competitors within the semiconductor industry might be moved to hasten up in the rolling out of their individual 2nm fabrication processes.