[ad_1]
Ahead of MWC later this month, Qualcomm has announced a new 5G modem in the Snapdragon X75. The company claims that this new modem “sets the benchmark for smartphone connectivity with the world’s first 5G Advanced-ready Modem-RF System”.
This is the 6th generation modem-to-antenna solution and it’s the first that is ready to support 5G Advanced. Which is going to be the next phase of 5G. This does introduce new architecture, a new software suite and includes numerous world’s first features to push the boundaries of connectivity. This includes latency, power efficiency, coverage and mobility.
It also uses a dedicated hardware tensor accelerator, the Qualcomm 5G AI Processor Gen 2. Which will enable over 2.5 times better AI performance. This is when compared to Gen 1.
What other features does the Snapdragon X75 have?
Qualcomm is proud to note that this is the first in the world to have 10-carrier aggregation for mmWave, 5x downlink carrier aggregation and FDD uplink MIMO for sub-6 GHz bands. This is going to allow for unparalleled spectrum aggregation and capacity.
It also has converged transceiver for mmWave and Sub-6 paired with new Qualcomm QTM565 fifth generation mmWave antenna modules. This will reduce cost, board complexity, hardware footprint and power consumption.
Qualcomm has also include AI-based sensor-assisted mmWave beam management for superior connectivity reliability and AI-based location accuracy enhancements. Qualcomm 5G PowerSave Gen 3 and Qualcomm RF Power Efficiency Suite is included here for extended battery life, carrying on from the most recent modems and SoCs from the company.
The new Snapdragon X75 5G modem is currently sampling and the company expects that commerical devices will launch in the second half of 2023. While we don’t know for sure, it sounds like this will be part of the Snapdragon 8+ Gen 2 that typically launches for the second half of the year.
[ad_2]
Source link